- 专利标题： COIL COMPONENT AND METHOD OF MANUFACTURING SAME
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申请号： US15487987申请日： 2017-04-14
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公开(公告)号： US20180019051A1公开(公告)日： 2018-01-18
- 发明人: Kang Wook BONG , Boum Seock KIM , Jae Hun KIM , Jong Sik YOON , Byeong Cheol MOON
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权： KR10-2016-0089438 20160714
- 主分类号： H01F27/28
- IPC分类号： H01F27/28 ; H01F27/29 ; H01F27/255 ; H01F27/32 ; H01F41/04
摘要：
A coil component includes an insulating layer having a coil shape, first and second coil conductor layers on opposing surfaces of the insulating layer, each having a coil shape corresponding to that of the insulating layer, and an encapsulant encapsulating the insulating layer and the first and second coil conductor layers.
公开/授权文献
- US10515754B2 Coil component and method of manufacturing same 公开/授权日：2019-12-24
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