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公开(公告)号：US20190198234A1
公开(公告)日：2019-06-27
申请号：US16101903
申请日：2018-08-13
发明人： Ji Hyung JUNG , Boum Seock KIM , Kang Wook BONG
IPC分类号： H01F27/32 , H01F27/28 , H01F27/245 , H01F41/04 , H01F41/12
CPC分类号： H01F27/323 , H01F27/245 , H01F27/2804 , H01F41/041 , H01F41/122 , H01F2027/2809
摘要： An inductor includes a body including a coil having a support member having a through hole and disposed on at least one surface of the support member, and a magnetic material encapsulating the support member and the coil, and filling the through hole, and external electrodes disposed on external surfaces of the body. The coil includes a plurality of coil patterns and an insulating layer disposed on surfaces of the plurality of coil patterns to insulate the plurality of adjacent coil patterns from each other, and the insulating layer includes a ceramic material.
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公开(公告)号：US20190006100A1
公开(公告)日：2019-01-03
申请号：US15828091
申请日：2017-11-30
IPC分类号： H01F41/04 , H01F17/00 , H01F27/29 , H01F27/28 , H01F27/255
摘要： A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer.
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公开(公告)号：US20190221356A1
公开(公告)日：2019-07-18
申请号：US16106861
申请日：2018-08-21
发明人： Kang Wook BONG , Mi Geum KIM , Boum Seock KIM
CPC分类号： H01F27/2804 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F27/324 , H01F41/041 , H01F2017/048 , H05K3/06
摘要： A coil component includes: a body in which a coil part is embedded, wherein the coil part includes: a support member; a pattern wall disposed on the support member; and a coil pattern extending between the pattern walls on the support member and including a plurality of winding turns. A width of an intermediate winding turn between innermost and outermost winding turns, among the plurality of winding turns of the coil pattern, is larger than widths of the innermost and outermost winding turns.
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公开(公告)号：US20180197672A1
公开(公告)日：2018-07-12
申请号：US15821003
申请日：2017-11-22
CPC分类号： H01F27/2804 , H01F17/0013 , H01F27/255 , H01F27/292 , H01F27/32 , H01F27/324 , H01F41/041 , H01F41/125
摘要： An inductor includes a body including a support member, a coil, and an encapsulant, and external electrodes on external surfaces of the body. The coil in the body may be formed so that a plurality of coil patterns are continuously formed, wherein the coil pattern includes first and second coil layers, and the encapsulant extends downward between adjacent coil patterns to be between first coil layers of adjacent coil patterns.
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公开(公告)号：US20190326055A1
公开(公告)日：2019-10-24
申请号：US16191419
申请日：2018-11-14
摘要： There are provided a coil component and a method of manufacturing the same. The coil component includes: a body portion including a magnetic material; a coil portion disposed in the body portion; and an electrode portion disposed on the body portion, wherein the coil portion includes a support member having groove portions formed in at least one surface thereof and a coil conductor layer filling the groove portions and protruding onto the at least one surface of the support member, the groove portions having planar spiral shapes.
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公开(公告)号：US20180019051A1
公开(公告)日：2018-01-18
申请号：US15487987
申请日：2017-04-14
IPC分类号： H01F27/28 , H01F27/29 , H01F27/255 , H01F27/32 , H01F41/04
摘要： A coil component includes an insulating layer having a coil shape, first and second coil conductor layers on opposing surfaces of the insulating layer, each having a coil shape corresponding to that of the insulating layer, and an encapsulant encapsulating the insulating layer and the first and second coil conductor layers.
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7.发明申请PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME AND STACK TYPE PACKAGE USING THE SAME 审中-公开封装板及其制造方法和堆叠型封装公开(公告)号：US20160021749A1
公开(公告)日：2016-01-21
申请号：US14736128
申请日：2015-06-10
发明人： Kang Wook BONG , Myung Sam KANG , Yong Wan JI , Hye Won JUNG , Yong Jin PARK , Young Gwan KO
CPC分类号： H05K1/111 , H01L21/6835 , H01L23/13 , H01L23/3128 , H01L23/49822 , H01L23/49833 , H01L25/105 , H01L2221/68345 , H01L2225/1023 , H01L2225/107 , H01L2225/1088 , H01L2924/15311 , H05K1/144 , H05K1/182 , H05K3/0023 , H05K3/0032 , H05K3/3478 , H05K3/4007 , H05K3/421 , H05K3/422 , H05K3/4697 , H05K2201/0347 , H05K2201/094 , H05K2203/0264 , H05K2203/0384 , H05K2203/041 , H05K2203/1383 , Y02P70/611
摘要： There are provided a package board, a method of manufacturing the same, and a stack type package using the same. The package board according to an exemplary embodiment of the present invention includes a first insulating layer formed with a cavity and an external connection terminal formed to penetrate through the first insulating layer and have one end protruding to an outside of one surface of the first insulating layer.
摘要翻译： 提供了一种封装板，其制造方法和使用该封装板的堆叠型封装。 根据本发明的示例性实施例的封装板包括形成有空腔的第一绝缘层和形成为穿透第一绝缘层的外部连接端子，并且具有突出到第一绝缘层的一个表面的外侧的一端 。
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8.发明申请PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE 审中-公开印刷电路板及其制造方法及半导体封装公开(公告)号：US20150156882A1
公开(公告)日：2015-06-04
申请号：US14334819
申请日：2014-07-18
发明人： Kang Wook BONG , Jin Won Lee
CPC分类号： H01L24/11 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/16 , H01L2224/03001 , H01L2224/0401 , H01L2224/04105 , H01L2224/05571 , H01L2224/05572 , H01L2224/06181 , H01L2224/10175 , H01L2224/16145 , H01L2224/16237 , H01L2224/73267 , H01L2224/81191 , H01L2224/81192 , H01L2924/12042 , H05K1/185 , H05K3/007 , H05K3/205 , H05K3/425 , H05K2201/0376 , H05K2201/1053 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , Y10T29/49139 , H01L2924/00 , H01L2924/00012
摘要： A printed circuit board may include a circuit pattern serving as a land. The circuit pattern may be embedded inside a via to forma larger amount of circuits within a limited region. Also, by implementing a shortest distance between an embedded electronic component and a surface mounting component, noise may be reduced and electrical characteristics may be enhanced.
摘要翻译： 印刷电路板可以包括用作焊盘的电路图案。 电路图案可以嵌入到通孔内，以在有限的区域内形成较大量的电路。 此外，通过实现嵌入式电子部件和表面安装部件之间的最短距离，可以降低噪声，并且可以提高电气特性。
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公开(公告)号：US20230178291A1
公开(公告)日：2023-06-08
申请号：US17985352
申请日：2022-11-11
发明人： Do Young JUNG , Kang Wook BONG
摘要： A coil component includes: a body including a magnetic material; a substrate disposed in the body; a coil unit including first and second coil patterns disposed on both surfaces of the substrate, respectively, first and second via pads connected to inner ends of the first and second coil patterns, respectively, and a via connecting the first and second via pads to each other; and first and second external electrodes disposed to be spaced apart from each other on the body, while respectively being connected to the coil unit, wherein the first and second via pads include connection portions connected to the first and second coil patterns, respectively, and wing portions protruding from both side surfaces of the connection portions, and each of the first and second via pads has substantially the same or smaller line width than each of the first and second coil patterns.
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公开(公告)号：US20190259522A1
公开(公告)日：2019-08-22
申请号：US16117385
申请日：2018-08-30
发明人： Jae Hun KIM , Byeong Cheol MOON , Kang Wook BONG
摘要： An inductor comprises a body and external electrodes arranged on an external surface of the body. The body includes a support member, a coil portion supported by the support member, and a sealing portion sealing the support member and the coil portion. The coil portion includes a plurality of coil patterns. A maximum thickness of each coil pattern in the plurality of coil patterns increases toward an outer portion of the body, and a line width of a lower surface in the coil patterns is wider than a line width of an upper surface.
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