- 专利标题: PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PRODUCTION OF PRINTED WIRING BOARD USING SAME
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申请号: US15549471申请日: 2016-01-25
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公开(公告)号: US20180023197A1公开(公告)日: 2018-01-25
- 发明人: Yoshikazu SAIJO , Hisamitsu YAMAMOTO , Tetsuji ISHIDA , Takuya KOMEDA , Masayuki UTSUMI
- 申请人: C. Uyemura & Co., Ltd.
- 申请人地址: JP Osaka
- 专利权人: C. Uyemura & Co., Ltd.
- 当前专利权人: C. Uyemura & Co., Ltd.
- 当前专利权人地址: JP Osaka
- 优先权: JP2015-025178 20150212
- 国际申请: PCT/JP2016/052017 WO 20160125
- 主分类号: C23C18/20
- IPC分类号: C23C18/20 ; H05K3/38
摘要:
The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.
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