- 专利标题: METHOD FOR PRODUCING SILICON CARBIDE COMPOSITE MATERIAL
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申请号: US15535627申请日: 2015-12-10
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公开(公告)号: US20180025919A1公开(公告)日: 2018-01-25
- 发明人: Takeshi MIYAKAWA , Daisuke GOTO
- 申请人: DENKA COMPANY LIMITED
- 申请人地址: JP Tokyo
- 专利权人: DENKA COMPANY LIMITED
- 当前专利权人: DENKA COMPANY LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2014-256201 20141218
- 国际申请: PCT/JP2015/084653 WO 20151210
- 主分类号: H01L21/48
- IPC分类号: H01L21/48 ; B28B11/24 ; H01L23/373 ; C04B38/06 ; C04B41/88 ; B28B1/14 ; C04B35/565
摘要:
A silicon carbide composite that is lightweight and has high thermal conductivity as well as a low thermal expansion coefficient close to that of a ceramic substrate, particularly a silicon carbide composite material suitable for heat dissipating components that are required to be particularly free of warping, such as heat sinks. A method for manufacturing a silicon carbide composite obtained by impregnating a porous silicon carbide molded body with a metal having aluminum as a main component, wherein the method for manufacturing a silicon carbide composite material is characterized in that the porous silicon carbide molded article is formed by a wet molding method, and preferably the wet molding method is a wet press method or is a wet casting method.
公开/授权文献
- US10529591B2 Method for producing silicon carbide composite material 公开/授权日:2020-01-07
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