公开(公告)号：US20170268834A1

公开(公告)日：2017-09-21

申请号：US15508187

申请日：2015-09-01

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Kazunori KOYANAGI

IPC: F28F21/02 ,  C22C49/06 ,  H01L23/373 ,  C22C21/02 ,  F28F21/08 ,  C22C26/00 ,  C22C47/12

Abstract: A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.

公开(公告)号：US20190030514A1

公开(公告)日：2019-01-31

申请号：US15779674

申请日：2016-11-28

Applicant: University of Yamanashi ,  Denka Company Limited

Inventor： Makoto UCHIDA ,  Katsuyoshi KAKINUMA ,  Daiki IKEDA ,  Yusaku HARADA ,  Takeshi MIYAKAWA

IPC: B01J23/42 ,  B01J32/00 ,  B01J37/08 ,  C09C1/48 ,  H01M4/96 ,  H01M8/10

Abstract: An electrode catalyst support, capable of improving the power of a fuel cell, and an electrode catalyst and a solid polymer fuel cell using the same.Provided is carbon black wherein pores which are at most 6 nm in pore diameter have a cumulative pore volume of less than 0.25 cm3/g, a specific surface area by BET is 500 to 900 m2/g, and a volatile matter content is 1.0 to 10.0%. Also provided are an electrode catalyst for a fuel cell comprising a support which includes this carbon black, and a solid polymer fuel cell having the electrode catalyst.

公开(公告)号：US20170130300A1

公开(公告)日：2017-05-11

申请号：US15318138

申请日：2015-07-03

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Shinya NARITA

IPC: C22C26/00 ,  C22C21/02 ,  C22C45/04 ,  C22C1/05

CPC classification number: C22C26/00 ,  B22F1/0003 ,  B22F1/0059 ,  B22F2998/10 ,  B22F2999/00 ,  B32B15/01 ,  C22C1/05 ,  C22C5/02 ,  C22C19/03 ,  C22C21/00 ,  C22C21/02 ,  C22C45/04 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/12083 ,  Y10T428/12889 ,  Y10T428/12944 ,  B22F7/04 ,  B22F2003/026 ,  B22F2003/145 ,  C22C1/051 ,  C23C14/00 ,  C25D5/00

Abstract: A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 μm and the area of a volumetric distribution of particle sizes of 45-205 μm is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.

公开(公告)号：US20170092560A1

公开(公告)日：2017-03-30

申请号：US15311268

申请日：2015-05-26

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi MIYAKAWA ,  Motonori KINO ,  Yosuke ISHIHARA

IPC: H01L23/373 ,  B23K35/30 ,  H01L21/48 ,  B22F1/02 ,  B22F1/00 ,  H01L23/367 ,  B23K1/00 ,  B23K35/36

CPC classification number: H01L23/3737 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/02 ,  B22F7/064 ,  B22F2301/255 ,  B22F2302/25 ,  B23K1/0016 ,  B23K35/3006 ,  B23K35/3602 ,  C22C5/06 ,  C22C5/08 ,  C22C26/00 ,  C22C30/02 ,  C22C30/06 ,  H01L21/4882 ,  H01L23/047 ,  H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/40 ,  H01L2924/16195

Abstract: A semiconductor package having, stacked in the following order, a heat dissipating member, a joining layer and an insulation member, wherein the heat dissipating member has an aluminum-diamond composite containing diamond grains and a metal containing aluminum; and the joining layer that joins the heat dissipating member and the insulation member is formed using a composite material having silver oxide fine particles or organic-coated silver fine particles having an average particle size of at least 1 nm and at most 100 μm.

公开(公告)号：US20170045314A1

公开(公告)日：2017-02-16

申请号：US15305262

申请日：2015-04-23

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Hideo TSUKAMOTO ,  Shinya NARITA

IPC: F28F13/18 ,  F28F21/08 ,  C01B31/06 ,  C22C26/00 ,  H01L23/373

CPC classification number: F28F13/18 ,  C01B32/28 ,  C01B32/914 ,  C22C1/05 ,  C22C1/10 ,  C22C26/00 ,  C22C2026/008 ,  F28F21/084 ,  F28F21/089 ,  F28F2255/06 ,  H01L23/373 ,  H01L23/3732 ,  H01L2924/0002 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/12083 ,  Y10T428/12889 ,  Y10T428/12944 ,  H01L2924/00

Abstract: An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 μm and the area of the volumetric distribution of grain sizes of 45-205 μm is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

Abstract translation: 具有接近于半导体器件的高热导率和热膨胀系数的铝 - 金刚石复合材料，并且即使在高负载下实际使用也可以抑制表面金属层部分的膨胀等的发生 。 铝 - 金刚石复合材料包括65-80vol％的圆形度至少为0.94的金刚石粉末，其中晶粒尺寸的体积分布中的第一个峰位于5-25μm，第二个峰位于55- 195μm，晶粒尺寸为1-35μm的体积分布面积与45-205μm粒径的体积分布面积之比为1:9〜4:6; 余量由含铝的金属组成。

公开(公告)号：US20170239715A1

公开(公告)日：2017-08-24

申请号：US15328723

申请日：2015-07-24

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi MIYAKAWA ,  Hideki HIROTSURU

IPC: B22D19/14 ,  B22D21/00 ,  C04B37/00 ,  B32B5/24 ,  B32B5/30 ,  B22D18/02 ,  C22C21/02

CPC classification number: B22D19/14 ,  B22D18/02 ,  B22D21/007 ,  B32B5/24 ,  B32B5/30 ,  B32B2250/02 ,  B32B2260/021 ,  B32B2260/025 ,  B32B2260/04 ,  B32B2262/105 ,  B32B2264/107 ,  B32B2307/302 ,  B32B2307/584 ,  B32B2311/24 ,  B32B2315/02 ,  B32B2605/00 ,  C04B37/001 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  C04B2237/365 ,  C04B2237/38 ,  C04B2237/61 ,  C04B2237/704 ,  C22C21/02 ,  C22C47/12 ,  C22C49/06 ,  C22C49/14 ,  C04B35/565 ,  C04B38/00 ,  C04B14/4625 ,  C04B41/4501 ,  C04B41/4582 ,  C04B41/4523 ,  C04B41/5155

Abstract: A composite production method includes impregnating a plate-shaped porous inorganic structure and a fibrous inorganic material with a metal while the fibrous inorganic material is arranged to be adjacent to the porous inorganic structure. In the composite structure, first and second phases are adjacent to each other by using a porous inorganic structure having a porous silicon carbide ceramic sintered body and the fibrous inorganic material, the first phase being a phase in which the porous silicon carbide ceramic sintered body is impregnated with the metal, the second phase being a phase in which the fibrous inorganic material is impregnated with the metal, a percentage of the porous silicon carbide ceramic sintered body in the first phase is 50 to 80 volume percent, and a percentage of the fibrous inorganic material in the second phase is 3 to 20 volume percent. A composite is produced by the method.

公开(公告)号：US20170236767A1

公开(公告)日：2017-08-17

申请号：US15500210

申请日：2015-07-29

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi MIYAKAWA ,  Motonori KINO ,  Hideki HIROTSURU

IPC: H01L23/373 ,  B22D19/00 ,  B22D18/02 ,  B22D17/00 ,  B32B9/00 ,  H05K1/02 ,  B32B9/04 ,  B32B15/20 ,  B21J5/00 ,  B21J1/00 ,  H01L23/367 ,  B22D21/00 ,  B32B3/26

Abstract: An aluminum-silicon carbide composite including flat-plate-shaped composited portion containing silicon carbide and an aluminum alloy, and aluminum layers containing an aluminum alloy provided on both plate surfaces of composited portion, wherein circuit board is mounted on one plate surface and the other plate surface is used as heat-dissipating surface, wherein: the heat-dissipating-surface-side plate surface of the composited portion has a convex curved shape; the heat-dissipating-surface-side aluminum layer has a convex curved shape; ratio (Ax/B) between the average (Ax) of the thicknesses at the centers on opposing short sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.91≦Ax/B≦1.00; and a ratio (Ay/B) between the average (Ay) of the thicknesses at the centers on opposing long sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.94≦Ay/B≦1.00 and production method therefor.

公开(公告)号：US20170142859A1

公开(公告)日：2017-05-18

申请号：US15322494

申请日：2015-07-03

Applicant: DENKA COMPANY LIMITED

Inventor： Takeshi MIYAKAWA ,  Motonori KINO

IPC: H05K7/20 ,  C22C21/02 ,  C09K5/14 ,  B22D19/14 ,  C04B41/51 ,  C04B41/00 ,  C22C21/08 ,  B22D21/00

CPC classification number: H05K7/209 ,  B22D19/00 ,  B22D19/14 ,  B22D21/007 ,  C04B41/009 ,  C04B41/5155 ,  C09K5/14 ,  C22C21/02 ,  C22C21/08 ,  H01L23/3733 ,  H01L23/4006

Abstract: A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.

公开(公告)号：US20190341330A1

公开(公告)日：2019-11-07

申请号：US16474690

申请日：2017-11-24

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Hiroaki OTA ,  Hideo TSUKAMOTO

IPC: H01L23/373 ,  C22C26/00 ,  C25D7/12 ,  C23C18/32

Abstract: A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 μm and 55-195 μm, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 μm and 45-205 μm is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.

公开(公告)号：US20180281230A1

公开(公告)日：2018-10-04

申请号：US15765931

申请日：2016-10-11

Applicant: DENKA COMPANY LIMITED

Inventor： Hiroaki OTA ,  Takeshi MIYAKAWA ,  Yosuke ISHIHARA

IPC: B28B19/00 ,  C09K5/14 ,  H01L23/373 ,  F28F21/08 ,  B28B11/24

Abstract: The present invention provides an aluminum-diamond composite which combines high thermal conductivity and a coefficient of thermal expansion close to a semiconductor clement, and in which the difference between the thicknesses of both surfaces is reduced so as to be suitable for use as a heat sink etc. for a semiconductor element. Provided is a flat plate-shaped aluminum-diamond composite that has an aluminum-diamond composite part and a surface layer that coats both surfaces of the composite part and includes a metal that has aluminum as a principal component, Wherein: the composite part is composed of a composite material that is composed of an aluminum or aluminum alloy matrix and diamond particles dispersed in said matrix; the composite material is composed of a diamond powder in which diamond particles having a particle size of 1-20 μm, inclusive, make up 10-40 vol of the diamond particles and diamond particles having a particle size of 100-250 μm, inclusive, make up 50-80 vol %, said powder not containing diamond particles having a particle size of less than 1 μm or diamond particles having a particle size of more than 250 μm; and the average value for the differences in in-plane thickness per 50 mm×50 mm is 100 μm or less.