- 专利标题: HOUSING AND ELECTRONIC DEVICE
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申请号: US15642892申请日: 2017-07-06
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公开(公告)号: US20180027707A1公开(公告)日: 2018-01-25
- 发明人: Yoshiaki Hiratsuka , Kai Nojima , Kenji NAGASE , Yoshinori MESAKI
- 申请人: FUJITSU LIMITED
- 申请人地址: JP Kawasaki-shi
- 专利权人: FUJITSU LIMITED
- 当前专利权人: FUJITSU LIMITED
- 当前专利权人地址: JP Kawasaki-shi
- 优先权: JP2016-142988 20160721
- 主分类号: H04B3/28
- IPC分类号: H04B3/28 ; H05K5/03 ; H05K9/00 ; H05K5/00
摘要:
A housing includes a first member that has a first conductor, a second member that has a second conductor and cooperates with the first member to accommodate a circuit board on which an electronic element is mounted, inside a space surrounded by the first conductor and the second conductor, and a plurality of connecting elements that are arranged at a predetermined arrangement interval y to fix the second member to the first member.
公开/授权文献
- US10172264B2 Housing and electronic device 公开/授权日:2019-01-01
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