- 专利标题: METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL
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申请号: US15726616申请日: 2017-10-06
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公开(公告)号: US20180033551A1公开(公告)日: 2018-02-01
- 发明人: Shinichi SAKAMOTO , Douglas James MALCOLM
- 申请人: SUMIDA CORPORATION
- 主分类号: H01F27/255
- IPC分类号: H01F27/255 ; H01F27/02 ; H01F27/24 ; H01F27/29 ; H01F27/28 ; H01F17/04 ; H01F41/02
摘要:
A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
公开/授权文献
- US10304624B2 Method for manufacturing electronic component with coil 公开/授权日:2019-05-28