公开(公告)号：US20190371524A1

公开(公告)日：2019-12-05

申请号：US16545618

申请日：2019-08-20

申请人： SUMIDA CORPORATION

发明人： Shinichi SAKAMOTO ,  Douglas James MALCOLM

IPC分类号： H01F41/064 ,  H01F17/04 ,  H01F27/29 ,  H01F27/255 ,  H01F41/02 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28

摘要： A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

公开(公告)号：US20200098515A1

公开(公告)日：2020-03-26

申请号：US16698609

申请日：2019-11-27

申请人： SUMIDA CORPORATION

发明人： Shinichi SAKAMOTO ,  Douglas James MALCOLM

IPC分类号： H01F41/064 ,  H01F17/04 ,  H01F27/29 ,  H01F27/255 ,  H01F41/02 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28

摘要： A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying a pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened, wherein a viscosity of the mixture is 1,000 to 1,000,000 mPa·s at room temperature.

公开(公告)号：US20200373086A1

公开(公告)日：2020-11-26

申请号：US16991131

申请日：2020-08-12

申请人： SUMIDA CORPORATION

发明人： Shinichi SAKAMOTO ,  Douglas James MALCOLM

IPC分类号： H01F41/064 ,  H01F17/04 ,  H01F27/29 ,  H01F27/255 ,  H01F41/02 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28

摘要： A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of an Fe—Si—Cr alloy, a thermosetting resin, and a solvent into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

公开(公告)号：US20180033551A1

公开(公告)日：2018-02-01

申请号：US15726616

申请日：2017-10-06

申请人： SUMIDA CORPORATION

发明人： Shinichi SAKAMOTO ,  Douglas James MALCOLM

IPC分类号： H01F27/255 ,  H01F27/02 ,  H01F27/24 ,  H01F27/29 ,  H01F27/28 ,  H01F17/04 ,  H01F41/02

CPC分类号： H01F41/064 ,  H01F17/04 ,  H01F27/022 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T29/4902 ,  Y10T29/49071

摘要： A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

公开(公告)号：US20150055311A1

公开(公告)日：2015-02-26

申请号：US13972271

申请日：2013-08-21

申请人： SUMIDA Corporation

发明人： Mitsugu KAWARAI ,  Douglas James MALCOLM

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/30

CPC分类号： H05K1/0215 ,  H05K1/0233 ,  H05K1/09 ,  H05K1/181 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/086 ,  H05K2203/1316 ,  Y02P70/611 ,  Y10T29/49146

摘要： An electronic component includes a circuit board that includes a ground terminal connected to a ground potential, a coil component that is assembled on the circuit board, the coil component includes a T-shaped core and an air-core coil, a ground connection electrode that is assembled on the circuit board next to the coil component and that is connected to the ground terminal, and a mixture of a metal composite magnetic material and a resin that is formed on the circuit board and that covers the coil component and the ground connection electrode as a package. A part of the ground connection electrode is exposed outside the mixture.

摘要翻译： 电子部件包括电路基板，其包括与接地电位相连的接地端子，组装在电路基板上的线圈部件，线圈部件包括T字形芯和空心线圈，接地连接电极， 组装在与线圈部件相邻的电路板上，并且与接地端子连接，并且形成在电路板上并覆盖线圈部件和接地连接电极的金属复合磁性材料和树脂的混合物 作为一个包装。 接地连接电极的一部分露出混合物外。

公开(公告)号：US20140259640A1

公开(公告)日：2014-09-18

申请号：US13804857

申请日：2013-03-14

申请人： SUMIDA CORPORATION

发明人： Shinichi SAKAMOTO ,  Douglas James MALCOLM

IPC分类号： H01F41/06

CPC分类号： H01F41/064 ,  H01F17/04 ,  H01F27/022 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T29/4902 ,  Y10T29/49071

摘要： A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

摘要翻译： 一种用于制造用于避免电磁干扰的电子部件的方法包括：（a）将T形芯和空芯线圈放置在金属模具中; （b）将复合磁性材料和树脂的混合物注入到金属模具中，使得T型芯和空芯线圈被混合物嵌入; （c）在第一温度下加热混合物; （d）调整外形同时去除过量的混合物; 和（e）硬化混合物。 该方法还可以包括抛光硬化混合物的外部的过程。 该方法可以进一步包括向混合物施加0.1至20.0kg / cm2的压力以在硬化过程之前通过冲压机的活动冲头调节混合物的外形的工艺。

公开(公告)号：US20220013285A1

公开(公告)日：2022-01-13

申请号：US17483852

申请日：2021-09-24

申请人： SUMIDA CORPORATION

发明人： Shinichi SAKAMOTO ,  Douglas James MALCOLM

IPC分类号： H01F41/064 ,  H01F17/04 ,  H01F27/29 ,  H01F27/255 ,  H01F41/02 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28

摘要： An inductor includes an air-core coil assembled with a T-shaped core and a composite magnetic material and resin mixture embedding the T-shaped core and the air-core coil. The air-core coil has: a coil member having a coil axis and first and second sides opposite to each other; and first and second leads that are integrally connected to the coil member. The first and second leads respectively have: first and second bent members at the first side; first and second ends at the second side; and first and second bottom extensions respectively connected between the first and second bent members and the first and second ends. The first and second bent members extend in a first direction parallel to the coil axis, the first and second ends extend in a second direction parallel to the coil axis, and the first and second bottom extensions extend perpendicular to the coil axis.

公开(公告)号：US20190244753A1

公开(公告)日：2019-08-08

申请号：US16385603

申请日：2019-04-16

申请人： SUMIDA CORPORATION

发明人： Shinichi SAKAMOTO ,  Douglas James MALCOLM

IPC分类号： H01F41/064 ,  H01F27/28 ,  H01F27/24 ,  H01F27/255 ,  H01F27/29 ,  H01F27/02 ,  H01F41/02 ,  H01F17/04

CPC分类号： H01F41/064 ,  H01F17/04 ,  H01F27/022 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29 ,  H01F41/02 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T29/4902 ,  Y10T29/49071

摘要： A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

公开(公告)号：US20150270064A1

公开(公告)日：2015-09-24

申请号：US14734004

申请日：2015-06-09

申请人： SUMIDA Corporation

发明人： Shinichi SAKAMOTO ,  Douglas James MALCOLM

IPC分类号： H01F41/06 ,  H01F27/28 ,  H01F27/24

CPC分类号： H01F41/064 ,  H01F17/04 ,  H01F27/022 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T29/4902 ,  Y10T29/49071

摘要： A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

摘要翻译： 一种用于制造用于避免电磁干扰的电子部件的方法包括：（a）将T形芯和空芯线圈放置在金属模具中; （b）将复合磁性材料和树脂的混合物注入到金属模具中，使得T型芯和空芯线圈被混合物嵌入; （c）在第一温度下加热混合物; （d）调整外形同时去除过量的混合物; 和（e）硬化混合物。 该方法还可以包括抛光硬化混合物的外部的过程。 该方法可以进一步包括向混合物施加0.1至20.0kg / cm2的压力以在硬化过程之前通过冲压机的活动冲头调节混合物的外形的工艺。