Invention Application
- Patent Title: ELECTRONIC PACKAGE THAT INCLUDES MULTI-LAYER STIFFENER
-
Application No.: US15548741Application Date: 2016-02-12
-
Publication No.: US20180033741A1Publication Date: 2018-02-01
- Inventor: Manish Dubey , Srikant Nekkanty , Rajendra C. Dias , Patrick Nardi
- Applicant: Intel Corporation
- International Application: PCT/US2016/017788 WO 20160212
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L23/58
Abstract:
An electronic package that includes a substrate and a die attached to the substrate. The electronic package further includes a stiffener that is attached to the substrate adjacent to the die. The stiffener is formed of a first layer made from one material and a second layer made from a different material.
Public/Granted literature
- US10535615B2 Electronic package that includes multi-layer stiffener Public/Granted day:2020-01-14
Information query
IPC分类:
