Invention Application
- Patent Title: METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE ADHESIVE FILM, ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND METHOD FOR MANUFACTURING CONNECTOR
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Application No.: US15729162Application Date: 2017-10-10
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Publication No.: US20180044558A1Publication Date: 2018-02-15
- Inventor: Seiichiro SHINOHARA
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2013-157098 20130729
- Main IPC: C09J9/02
- IPC: C09J9/02 ; H01R4/04 ; C09J7/00 ; H05K3/32 ; H01R43/00 ; H05K3/30 ; C09J11/04 ; C08K3/04 ; C08K3/08 ; H01R12/62
Abstract:
A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.
Information query
IPC分类:
