Invention Application
- Patent Title: PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH
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Application No.: US15673569Application Date: 2017-08-10
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Publication No.: US20180047650A1Publication Date: 2018-02-15
- Inventor: Bradley Paul Barber , Kezia Cheng
- Applicant: SKYWORKS SOLUTIONS, INC.
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L21/56

Abstract:
According to various aspects and embodiments, a support structure for packaging an electronic device is provided. In one example, a packaged electronic device includes a substrate, at least one electronic device disposed on the substrate, an encapsulation structure disposed on the substrate and having a wall that forms a perimeter around the at least one electronic device, and at least one support structure formed from a photosensitive polymer and disposed adjacent the wall of the encapsulation structure. The at least one support structure has a configuration that provides at least one of increased adhesion and mechanical strength to the encapsulation structure.
Public/Granted literature
- US10453763B2 Packaging structures with improved adhesion and strength Public/Granted day:2019-10-22
Information query
IPC分类: