Invention Application
- Patent Title: LPS SOLDER PASTE BASED LOW COST FINE PITCH POP INTERCONNECT SOLUTIONS
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Application No.: US15792569Application Date: 2017-10-24
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Publication No.: US20180047693A1Publication Date: 2018-02-15
- Inventor: Nachiket R. RARAVIKAR , James C. MATAYABAS, JR. , Akshay MATHKAR
- Applicant: Intel Corporation
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/00 ; B23K35/22 ; H01L25/10 ; H01L23/498 ; H01L23/538

Abstract:
Embodiments describe high aspect ratio and fine pitch interconnects for a semiconductor package, such as a package-on-package structure. In an embodiment, the interconnects are formed with a no-slump solder paste. In an embodiment, the no-slump solder paste is printed in an uncured state, and is then cured with a liquid phase sintering process. After being cured, the no-slump solder paste will not reflow at typical processing temperatures, such as those below approximately 400° C. According to embodiments, the no-slump solder paste includes Cu particles or spheres, a solder matrix component, a polymeric delivery vehicle, and a solvent. In an embodiment, the liquid phase sintering produces a shell of intermetallic compounds around the Cu spheres. In an embodiment, the sintering process builds a conductive metallic network through the no-slump solder paste.
Public/Granted literature
- US10586779B2 LPS solder paste based low cost fine pitch pop interconnect solutions Public/Granted day:2020-03-10
Information query
IPC分类: