Invention Application
- Patent Title: MULTILAYER CERAMIC ELECTRONIC COMPONENT
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Application No.: US15708474Application Date: 2017-09-19
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Publication No.: US20180082788A1Publication Date: 2018-03-22
- Inventor: Hiroshi ASANO , Nobuyasu HAMAMORI
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2016-183315 20160920
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/14 ; H01G4/005 ; H01G4/232

Abstract:
In a multilayer ceramic electronic component, a first organic layer covers from a first base electrode layer to at least a portion of the surface of a laminated body, and a second organic layer covers from a second base electrode layer to at least a portion of the surface of the laminated body, and a first plating layer includes a leading end in contact with the first organic layer, with the first organic layer of about 5 nm or more and about 500 nm or less in thickness at an end of the first base electrode layer, and a second plating layer has a leading end in contact with the second organic layer, with the second organic layer of about 5 nm or more and about 500 nm or less in thickness at an end of the second base electrode layer.
Public/Granted literature
- US10541085B2 Multilayer ceramic electronic component including an organic layer Public/Granted day:2020-01-21
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