公开(公告)号：US20180082785A1

公开(公告)日：2018-03-22

申请号：US15708462

申请日：2017-09-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi ASANO ,  Nobuyasu HAMAMORI ,  Ichitaro OKAMURA ,  Koji MATSUSHITA ,  Yoshiyuki NOMURA

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/14 ,  H01G4/005 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/14 ,  H01G4/232 ,  H01G4/2325

Abstract: A multilayer ceramic electronic component includes a first organic layer that covers from a first base electrode layer to at least a portion of a surface of a laminated body, a second organic layer that covers from a second base electrode layer to at least a portion of the surface of the laminated body, a first plating layer that includes a leading end in contact with the first organic layer and that has an atomic concentration ratio of Si to Cu of about 1% or more and about 5% or less between a Cu concentration and an Si concentration at the surface of the first organic layer, and a second plating layer that includes a leading end in contact with the second organic layer and that has an atomic concentration ratio of Si to Cu being about 1% or more and about 5% or less between a Cu concentration and an Si concentration at the surface of the second organic layer.

公开(公告)号：US20180082787A1

公开(公告)日：2018-03-22

申请号：US15708469

申请日：2017-09-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuyasu HAMAMORI ,  Hiroshi ASANO ,  Yoshiyuki NOMURA ,  Koji MATSUSHITA ,  Ichitaro OKAMURA

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G4/14 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/14 ,  H01G4/232

Abstract: A multilayer ceramic electronic component includes a first plating layer in contact with a first organic layer and a second plating layer in contact with a second organic layer. When the first organic layer disposed on a first base electrode layer located on a first principal surface or a second principal surface, or the second organic layer disposed on a second base electrode layer located thereon, is referred to as an organic layer principal surface portion, and when the first organic layer disposed on the first base electrode layer located on a first end surface or a second end surface, or the second organic layer disposed on the second base electrode layer located thereon, is referred to as an organic layer end surface portion, the surface roughness of the organic layer end surface portion is larger than the surface roughness of the organic layer principal surface portion.

公开(公告)号：US20180082786A1

公开(公告)日：2018-03-22

申请号：US15708464

申请日：2017-09-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi ASANO ,  Nobuyasu HAMAMORI

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/14 ,  H01G4/005 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325

Abstract: In a multilayer ceramic capacitor, A>B is satisfied by an atomic concentration ratio B of Si to Cu in a first organic layer disposed on a first base electrode layer located on a first end surface, an atomic concentration ratio A of Si to Cu in the first organic layer disposed on the first base electrode layer located on a first principal surface and a second principal surface, and an atomic concentration ratio A of Si to Cu in the first organic layer located directly on the first principal surface and the second principal surface.

公开(公告)号：US20180082788A1

公开(公告)日：2018-03-22

申请号：US15708474

申请日：2017-09-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi ASANO ,  Nobuyasu HAMAMORI

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/14 ,  H01G4/005 ,  H01G4/232

Abstract: In a multilayer ceramic electronic component, a first organic layer covers from a first base electrode layer to at least a portion of the surface of a laminated body, and a second organic layer covers from a second base electrode layer to at least a portion of the surface of the laminated body, and a first plating layer includes a leading end in contact with the first organic layer, with the first organic layer of about 5 nm or more and about 500 nm or less in thickness at an end of the first base electrode layer, and a second plating layer has a leading end in contact with the second organic layer, with the second organic layer of about 5 nm or more and about 500 nm or less in thickness at an end of the second base electrode layer.

公开(公告)号：US20230317375A1

公开(公告)日：2023-10-05

申请号：US18124606

申请日：2023-03-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuichiro MORIMOTO ,  Toshiyuki NAKAMURA ,  Noriyuki OOKAWA ,  Daisho TSUBOKAWA ,  Masaru TAKAHASHI ,  Nobuyasu HAMAMORI

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G2/06

CPC classification number: H01G4/2325 ,  H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G2/065

Abstract: In a three-terminal multilayer ceramic capacitor, each of first through fourth external electrodes includes a base electrode layer including a conductive metal and a glass component, an organic layer including an organosilicon compound covering the base electrode layer, and a plating layer on the organic layer. On a surface of the organic layer in a portion facing the plating layer, an atomic concentration ratio of Si to Cu is greater than or equal to about 1.5% and less than or equal to about 5.5%, or greater than or equal to about 0.8% and less than or equal to about 2.8%, and a surface roughness is greater than or equal to about 0.334 and less than or equal to about 0.371, or greater than or equal to about 0.352 and less than or equal to about 0.395.

公开(公告)号：US20180082789A1

公开(公告)日：2018-03-22

申请号：US15708476

申请日：2017-09-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroshi ASANO ,  Nobuyasu HAMAMORI ,  Koji MATSUSHITA

IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G4/14 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G2/10 ,  H01G2/14 ,  H01G4/005 ,  H01G4/12 ,  H01G4/14 ,  H01G4/232

Abstract: A multilayer ceramic electronic component includes a first organic layer located on both principal surfaces and both side surfaces in contact with a first external electrode, and a second organic layer located on the both principal surfaces and the both side surfaces in contact with a second external electrode. The first organic layer includes an organic silicon compound and covers an end of a first base electrode layer of the first external electrode, and the second organic layer includes an organic silicon compound and covers an end of a second base electrode layer of the second external electrode. A first plating layer of the first external electrode includes an end in contact with the surface of the first organic layer, and a second plating layer of the second external electrode includes an end in contact with the surface of the second organic layer.