Invention Application
- Patent Title: FAN-OUT PACKAGE STRUCTURE HAVING STACKED CARRIER SUBSTRATES AND METHOD FOR FORMING THE SAME
-
Application No.: US15700220Application Date: 2017-09-11
-
Publication No.: US20180082936A1Publication Date: 2018-03-22
- Inventor: Shih-Yi SYU , Chia-Yu JIN , Che-Ya CHOU , Wen-Sung HSU , Nan-Cheng CHEN
- Applicant: MEDIATEK INC.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/42 ; H01L23/64 ; H01L23/31 ; H01L21/48
Abstract:
A semiconductor package structure is provided. The semiconductor package structure includes a first carrier substrate having a first surface and an opposing second surface. A second carrier substrate is stacked on the first carrier substrate and has a first surface and an opposing second surface that faces the first surface of the first carrier substrate. A semiconductor die is mounted on the first surface of the second carrier substrate. A heat spreader is disposed on the first surface of the first carrier substrate to cover and surround the second carrier substrate and the semiconductor die. A method for forming the semiconductor package structure is also provided.
Public/Granted literature
- US10515887B2 Fan-out package structure having stacked carrier substrates and method for forming the same Public/Granted day:2019-12-24
Information query
IPC分类:
