Invention Application
- Patent Title: DISPLAY APPARATUS AND METHOD OF MANUFACTURING THEREOF, PACKAGE COVER PLATE
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Application No.: US15713465Application Date: 2017-09-22
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Publication No.: US20180083086A1Publication Date: 2018-03-22
- Inventor: Yulin WANG , Li SUN
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD
- Priority: CN201621072503.0 20160922
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L51/52 ; H01L51/56

Abstract:
A display apparatus includes a display substrate, a package cover plate on the display substrate, and a plurality of FPCs; at one end of the FPC is a driver IC, and the other end of the FPC is connected to the display substrate; a groove is at the edge of the surface away from the display substrate, and the opening direction of the groove deviates from the display substrate; the groove includes a first groove wall, and a second and third groove walls, wherein the first groove wall is located within the package cover plate and the two sides of which are connected to one side of each of the second and third groove walls, respectively, while the other side of each of the second and third groove walls extends to the edge of the package cover plate.
Public/Granted literature
- US10312316B2 Display apparatus and method of manufacturing the same, package cover plate Public/Granted day:2019-06-04
Information query
IPC分类: