Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE INCLUDING ANTENNA SUBSTRATE AND MANUFACTURING METHOD THEREOF
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Application No.: US15826543Application Date: 2017-11-29
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Publication No.: US20180083341A1Publication Date: 2018-03-22
- Inventor: Han-Chee YEN
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L23/31 ; H01L23/66 ; H01L23/00 ; H01L25/16 ; H01Q9/04 ; H01L21/56
Abstract:
A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.
Public/Granted literature
- US11664580B2 Semiconductor package including antenna substrate and manufacturing method thereof Public/Granted day:2023-05-30
Information query
