A contact module includes a dielectric body holding signal contacts and a shield coupled to the dielectric body having grounding portions providing electrical shielding for the signal contacts. Each grounding portion includes a base edge generally coplanar with the base edges of the signal contacts and a compliant pin extending below the base edge. Each grounding portion includes a surface tab extending below the base edge to at least partially fill a space between the base edge of the grounding portion and a mounting surface of the circuit board such that the surface tab provides electrical shielding for the compliant pins of the signal contacts in the space between the base edge of the signal contact and the mounting surface of the circuit board.