Invention Application
- Patent Title: THERMOSETTING RESIN COMPOSITION, ELECTRONIC PART, ELECTRIC MACHINE COIL, ELECTRIC MACHINE, AND CABLE
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Application No.: US15540692Application Date: 2015-01-26
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Publication No.: US20180086876A1Publication Date: 2018-03-29
- Inventor: Yasuhiko TADA , Takahito MURAKI , Yuri KAJIHARA
- Applicant: HITACHI, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI, LTD.
- Current Assignee: HITACHI, LTD.
- Current Assignee Address: JP Tokyo
- International Application: PCT/JP2015/051954 WO 20150126
- Main IPC: C08G59/68
- IPC: C08G59/68 ; G03F7/20 ; G03F7/039 ; G03F7/40 ; H01L21/027

Abstract:
It is an object of the present invention to provide a thermosetting resin composition which allows stress relaxation in an ester exchange reaction and the long-term use of the thermosetting resin composition having such a structure. A thermosetting resin composition of the present invention contains: an ester bond; and a functional group protected by a protecting group. The functional group is deprotected by external stimulus. The functional group and the ester bond can be subjected to an ester exchange reaction.
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