Invention Application
- Patent Title: EXTENDED PLATFORM WITH ADDITIONAL MEMORY MODULE SLOTS PER CPU SOCKET AND CONFIGURED FOR INCREASED PERFORMANCE
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Application No.: US15283186Application Date: 2016-09-30
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Publication No.: US20180095909A1Publication Date: 2018-04-05
- Inventor: Bruce QUERBACH , Pete D. VOGT
- Applicant: INTEL CORPORATION
- Main IPC: G06F13/16
- IPC: G06F13/16

Abstract:
Electronic devices and methods including a printed circuit board configured to accept CPUs and memory modules are described. One apparatus includes a printed circuit board (PCB) that includes a printed circuit board defining a length and a width, the length being greater than the width. The apparatus includes a first row of elements on thePCB, including a first memory region configured to receive at least one memory module. The apparatus includes a second row of elements on the PCB, including a first central processing unit (CPU) socket configured to receive a first CPU, and a second CPU socket configured to receive a second CPU, the first CPU socket and the second CPU socket positioned side by side along the width of the PCB. The apparatus also includes a third row of elements on the PCB, including a second memory region configured to receive a at least one memory module, wherein the second row of elements is positioned between the first row of elements and the third rows of elements. Other embodiments are described and claimed.
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