Invention Application
- Patent Title: ETHERNET MAGNETICS PACKAGE WIRE TERMINATIONS
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Application No.: US15816604Application Date: 2017-11-17
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Publication No.: US20180096774A1Publication Date: 2018-04-05
- Inventor: William Frank Edwards , Ki-Yuen Chau , Keith Frank Tharp , George Curtis , Kayen Lin
- Applicant: Cisco Technology, Inc.
- Main IPC: H01F27/06
- IPC: H01F27/06 ; H01F27/04 ; H01F27/28 ; H01F27/29 ; H01R13/00 ; H01F41/10 ; H01R43/01 ; H01R13/719 ; H01F27/30 ; H01F17/00 ; H01R4/02 ; H01R24/64 ; H01F17/06 ; H01R107/00 ; H01R43/02

Abstract:
In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.
Public/Granted literature
- US10446312B2 Ethernet magnetics package wire terminations Public/Granted day:2019-10-15
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