公开(公告)号：US10446312B2

公开(公告)日：2019-10-15

申请号：US15816604

申请日：2017-11-17

Applicant: Cisco Technology, Inc.

Inventor： William Frank Edwards ,  Ki-Yuen Chau ,  Keith Frank Tharp ,  George Curtis ,  Kayen Lin

IPC: H01R43/00 ,  H01F27/06 ,  H01F27/28 ,  H01F27/29 ,  H01F41/10 ,  H01F27/04 ,  H01F27/30 ,  H01R13/00 ,  H01R43/01 ,  H01R13/719 ,  H01F17/06 ,  H01F17/00 ,  H01R4/02 ,  H01R24/64 ,  H01R43/02 ,  H01R107/00

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

公开(公告)号：US09881725B2

公开(公告)日：2018-01-30

申请号：US14550256

申请日：2014-11-21

Applicant: Cisco Technology, Inc.

Inventor： William Frank Edwards ,  Ki-Yuen Chau ,  Keith Frank Tharp ,  George Curtis ,  Kayen Lin

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/29 ,  H01F27/06 ,  H01F41/10 ,  H01F27/04 ,  H01F27/30 ,  H01R13/00 ,  H01R43/01 ,  H01R13/719 ,  H01F17/06 ,  H01F17/00 ,  H01R4/02 ,  H01R24/64 ,  H01R43/02 ,  H01R107/00

CPC classification number: H01F27/06 ,  H01F17/062 ,  H01F27/04 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/306 ,  H01F41/10 ,  H01F2017/0093 ,  H01F2027/065 ,  H01R4/023 ,  H01R4/027 ,  H01R13/00 ,  H01R13/719 ,  H01R24/64 ,  H01R43/01 ,  H01R43/0221 ,  H01R2107/00

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

公开(公告)号：US20180096774A1

公开(公告)日：2018-04-05

申请号：US15816604

申请日：2017-11-17

Applicant: Cisco Technology, Inc.

Inventor： William Frank Edwards ,  Ki-Yuen Chau ,  Keith Frank Tharp ,  George Curtis ,  Kayen Lin

IPC: H01F27/06 ,  H01F27/04 ,  H01F27/28 ,  H01F27/29 ,  H01R13/00 ,  H01F41/10 ,  H01R43/01 ,  H01R13/719 ,  H01F27/30 ,  H01F17/00 ,  H01R4/02 ,  H01R24/64 ,  H01F17/06 ,  H01R107/00 ,  H01R43/02

CPC classification number: H01F27/06 ,  H01F17/062 ,  H01F27/04 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/306 ,  H01F41/10 ,  H01F2017/0093 ,  H01F2027/065 ,  H01R4/023 ,  H01R4/027 ,  H01R13/00 ,  H01R13/719 ,  H01R24/64 ,  H01R43/01 ,  H01R43/0221 ,  H01R2107/00 ,  Y10T29/49194

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.