Invention Application
- Patent Title: System and Method for Process-Induced Distortion Prediction During Wafer Deposition
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Application No.: US15707927Application Date: 2017-09-18
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Publication No.: US20180096906A1Publication Date: 2018-04-05
- Inventor: Ady Levy , Mark D. Smith
- Applicant: KLA-Tencor Corporation
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/67 ; G01B11/06
Abstract:
A system is disclosed. The system includes a tool cluster. The tool cluster includes a first deposition tool configured to deposit a first layer on a wafer. The tool cluster additionally includes an interferometer tool configured to obtain one or more measurements of the wafer. The tool cluster additionally includes a second deposition tool configured to deposit a second layer on the wafer. The tool cluster additionally includes a vacuum assembly. One or more correctables configured to adjust at least one of the first deposition tool or the second deposition tool are determined based on the one or more measurements. The one or more measurements are obtained between the deposition of the first layer and the deposition of the second layer without breaking the vacuum generated by the vacuum assembly.
Public/Granted literature
- US10475712B2 System and method for process-induced distortion prediction during wafer deposition Public/Granted day:2019-11-12
Information query
IPC分类:
