A method for manufacturing a bond pad structure includes providing a substrate structure including a substrate, a first metal layer on the substrate, and a passivation layer on the first metal layer, the passivation layer having an opening extending to the first metal layer; and filling the opening of the passivation layer with a second metal layer. The bond pad structure has a significantly increased thickness compared with the thickness of the exposed portion of the first metal layer in the opening, thereby ensuring wire bonding reliability and yield.