Invention Application
- Patent Title: Multi-Purpose Non-Linear Semiconductor Package Assembly Line
-
Application No.: US15284580Application Date: 2016-10-04
-
Publication No.: US20180096966A1Publication Date: 2018-04-05
- Inventor: Thorsten Meyer , Gerald Ofner , Peter Scherl , Stephan Bradl , Stefan Miethaner , Alexander Heinrich , Horst Theuss
- Applicant: Infineon Technologies AG
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L21/78
Abstract:
A method of producing packaged semiconductor devices includes providing a first packaging substrate panel. A second packaging substrate panel is provided. The first and second packaging substrate panels are moved through an assembly line that includes a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The second type packaged semiconductor device is different than the first type packaged semiconductor device. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner.
Public/Granted literature
- US10566309B2 Multi-purpose non-linear semiconductor package assembly line Public/Granted day:2020-02-18
Information query
IPC分类:
