A fan-out semiconductor package includes: a first connection member having a through-hole; a first component disposed in the through-hole; a second component disposed in the through-hole and attached to the first component; an encapsulant filling at least portions of spaces between walls of the through-hole and side surfaces of the first component and side surfaces of the second component; a second connection member disposed on the first connection member and the first component; and a third connection member disposed on the first connection member and the second component. A number of at least one of the first or second components is plural, the second and third connection members are connected to each other through the first connection member, and the first connection member includes a redistribution layer electrically connected to a redistribution layer of the second connection member and a redistribution layer of the third connection member.