摘要:
Embodiments of the invention provide a camera module including a lens barrel part in which a plurality of lenses are stacked, a housing having the lens barrel part disposed therein, and an infrared (IR)-cut filter provided in the housing and disposed at a lower portion of the lens barrel part. According to at least one embodiment, the camera module further includes a circuit board having a window formed therein so as to penetrate through a central region thereof and supporting a bottom surface of the housing; an image sensor accommodated in the window of the circuit board and converting an external image into an electrical signal, and a plate coupled to a lower portion of the circuit board to radiate heat generated from the circuit board.
摘要:
A fan-out semiconductor package includes: a first connection member having a through-hole; a first component disposed in the through-hole; a second component disposed in the through-hole and attached to the first component; an encapsulant filling at least portions of spaces between walls of the through-hole and side surfaces of the first component and side surfaces of the second component; a second connection member disposed on the first connection member and the first component; and a third connection member disposed on the first connection member and the second component. A number of at least one of the first or second components is plural, the second and third connection members are connected to each other through the first connection member, and the first connection member includes a redistribution layer electrically connected to a redistribution layer of the second connection member and a redistribution layer of the third connection member.
摘要:
There is provided a vibration generating device including: a housing having an internal space and including installation bars; a vibration member having through holes which are formed in both end portions thereof and which is fixedly attached to the installation bars by allowing upper end portions of the installation bars to penetrate through the through holes; a piezoelectric element installed on the vibration member; and a fixing unit fixing the vibration member to the installation bars.
摘要:
A vibration generating apparatus may include a housing having an internal space, an elastic member mounted in the internal space, a piezoelectric element having one surface thereof mounted on the elastic member, and a mass body fixed to the other surface of the piezoelectric element by a buffering adhesive.
摘要:
A camera module includes a movable portion including a lens barrel, an accommodating portion configured to receive the movable portion, and a driving unit configured to drive the movable portion, comprising a driving magnet integrated with the movable portion. A cross-sectional area of the driving magnet decreases as a distance thereof from an optical axis increases.
摘要:
A camera module includes: a housing; a first lens module movably disposed in the housing in an optical axis direction; a folded module including a reflective member configured to change a direction of light incident into the housing toward the first lens module; and a first damper coupled to the first lens module, and configured to alleviate impacts between the housing and the first lens module.
摘要:
There is provided an apparatus for generating vibrations including: a housing having an internal space; a direction changing member installed in the housing so as to be disposed in the internal space; a piezoelectric actuator including a piezoelectric element fixed to the direction changing member such that a horizontal deformation thereof is restrained, and deforming the direction changing member by a horizontal deformation thereof; and a vibrator fixed to the direction changing member and vertically displaced in a vertical direction according to a vertical deformation of the piezoelectric actuator.
摘要:
A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant filling at least portions of spaces between walls of the through-hole and side surfaces of the semiconductor chip; and a second interconnection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip through vias, wherein the side surface of the semiconductor chip has a step portion.
摘要:
There are provided a vibration generating apparatus and an electronic apparatus including the same. The vibration generating apparatus includes: a housing having an internal space; an elastic member having both ends fixed to the housing so as to be elastically deformably disposed in the internal space; and a piezoelectric element mounted on one surface of the elastic member, wherein power is supplied to the piezoelectric element so that warpage of the piezoelectric element is only generated toward any one of one surface of the elastic member and the other surface of the elastic member, a surface opposite to the one surface of the elastic member.
摘要:
A camera module includes: a housing; a first lens module movably disposed in the housing in an optical axis direction; a folded module including a reflective member configured to change a direction of light incident into the housing toward the first lens module; and a first damper coupled to the first lens module, and configured to alleviate impacts between the housing and the first lens module.