- 专利标题: SEMICONDUCTOR DEVICE, SOLID-STATE IMAGE SENSOR AND CAMERA SYSTEM
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申请号: US15832951申请日: 2017-12-06
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公开(公告)号: US20180097031A1公开(公告)日: 2018-04-05
- 发明人: Shunichi Sukegawa , Noriyuki Fukushima
- 申请人: Sony Corporation
- 优先权: JP2010-002979 20100108; JP2010-255934 20101116
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H04N5/369 ; H04N5/232 ; H01L25/16
摘要:
The present invention relates to a semiconductor device, a solid-state image sensor and a camera system capable of reducing the influence of noise at a connection between chips without a special circuit for communication and reducing the cost as a result. The semiconductor device includes: a first chip; and a second chip, wherein the first chip and the second chip are bonded to have a stacked structure, the first chip has a high-voltage transistor circuit mounted thereon, the second chip has mounted thereon a low-voltage transistor circuit having lower breakdown voltage than the high-voltage transistor circuit, and wiring between the first chip and the second chip is connected through a via formed in the first chip.