Invention Application
- Patent Title: ACTUATABLE AND ADAPTABLE METAMATERIALS INTEGRATED IN PACKAGE
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Application No.: US15283140Application Date: 2016-09-30
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Publication No.: US20180097284A1Publication Date: 2018-04-05
- Inventor: Shawna M. LIFF , Adel A. ELSHERBINI , Sasha N. OSTER , Feras EID , Georgios C. DOGIAMIS , Thomas L. SOUNART , Johanna M. SWAN
- Applicant: Intel Corporation
- Main IPC: H01Q1/52
- IPC: H01Q1/52 ; H01L41/09 ; H01L41/047 ; H01L41/187 ; H01L41/04 ; H01Q5/50 ; H04L29/06

Abstract:
Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.
Public/Granted literature
- US10594029B2 Actuatable and adaptable metamaterials integrated in package Public/Granted day:2020-03-17
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