Invention Application
- Patent Title: PACKAGE INTEGRATED SECURITY FEATURES
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Application No.: US15283129Application Date: 2016-09-30
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Publication No.: US20180097693A1Publication Date: 2018-04-05
- Inventor: Shawna M. LIFF , Adel A. ELSHERBINI , Sasha N. OSTER , Feras EID , Georgios C. DOGIAMIS , Thomas L. SOUNART , Johanna M. SWAN
- Applicant: Intel Corporation
- Main IPC: H04L12/24
- IPC: H04L12/24 ; H01H57/00 ; H01L41/047 ; H01L41/187 ; A61B5/0205 ; A61B5/00

Abstract:
Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.
Public/Granted literature
- US10116504B2 Package integrated security features Public/Granted day:2018-10-30
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