发明申请
- 专利标题: Method of Assembly of Electrochemical Cells for High Temperature Applications
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申请号: US15330629申请日: 2016-10-19
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公开(公告)号: US20180108496A1公开(公告)日: 2018-04-19
- 发明人: Sagar Venkateswaran , Franciscus X. Pratiktohadi
- 申请人: Sagar Venkateswaran , Franciscus X. Pratiktohadi
- 主分类号: H01G11/86
- IPC分类号: H01G11/86 ; H01M10/0525 ; H01M10/0585 ; H01M10/04 ; H01M2/08 ; H01M4/04 ; B23K11/00 ; B23K26/22 ; B23K20/10 ; H01G11/78 ; H01G11/74 ; H01G11/66 ; H01G11/52 ; H01G11/24 ; H01G11/58
摘要:
Heat resistant, highly conductive electrochemical cells for high temperature applications and methods of their assembly are described herein. The cells have at least two electrodes and at least one separator enclosed in heat resistant ceramic enclosure with metalized terminals on its bottom. Methods of the electrodes' tabs welding to inside connectors and the electrodes' coating are also disclosed. The resulting cells are solderable to circuit boards or various circuits.