Invention Application
- Patent Title: DEVICE AND METHOD FOR ALIGNMENT OF VERTICALLY STACKED WAFERS AND DIE
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Application No.: US15851467Application Date: 2017-12-21
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Publication No.: US20180114756A1Publication Date: 2018-04-26
- Inventor: John H. ZHANG , Walter KLEEMEIER , Paul FERREIRA , Ronald K. SAMPSON
- Applicant: STMicroelectronics, Inc.
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/66 ; H01L25/00 ; H01L25/065
Abstract:
A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively.
Information query
IPC分类:
