- 专利标题： Compliant Needle for Direct Transfer of Semiconductor Devices
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申请号： US15343055申请日： 2016-11-03
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公开(公告)号： US20180122673A1公开(公告)日： 2018-05-03
- 发明人: Justin Wendt , Andrew Huska , Cody Peterson , Clinton Adams , Sean Kupcow
- 申请人： Rohinni, LLC
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; H01L21/683 ; H01L21/687
摘要：
An apparatus includes a needle and a needle actuator to move the needle to a position at which the needle presses an electrically-actuatable element into contact with a circuit trace. When the needle presses the electrically-actuatable element into contact with the circuit trace, a dampener, arranged with the needle and the needle actuator, dampens a force applied to the electrically-actuatable element.
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