公开(公告)号：US20200251453A1

公开(公告)日：2020-08-06

申请号：US16856970

申请日：2020-04-23

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  H01L21/683 ,  H01L23/544 ,  H01L23/00 ,  H01L21/48 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L21/67 ,  H01L33/62 ,  G02F1/13357 ,  H01L23/532

摘要： A method includes loading a wafer tape into a first frame, the wafer tape having a first side and a second side, a first semiconductor device die being disposed on the first side of the wafer tape. A substrate is loaded into a second frame, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred. A needle is oriented to a position adjacent to the second side of the wafer tape, the needle extending in a direction toward the wafer tape, and a needle actuator connected to the needle is activated to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

公开(公告)号：US20200168587A1

公开(公告)日：2020-05-28

申请号：US16694665

申请日：2019-11-25

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  G02F1/13357 ,  H01L23/532 ,  H01L21/677 ,  H01L21/67 ,  H01L21/66 ,  H01L33/62 ,  H01L23/00 ,  H01L21/687 ,  H01L21/68 ,  H01L21/48 ,  H01L23/544 ,  H01L21/683

摘要： A system performs a direct transfer of a semiconductor device die from a first substrate to a second substrate. A semiconductor device die is disposed on a first side of the first substrate. The system includes a first conveyance mechanism to convey the first substrate, and a second conveyance mechanism to convey the second substrate with respect to the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to the first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also comprises a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.

公开(公告)号：US20190237445A1

公开(公告)日：2019-08-01

申请号：US16381982

申请日：2019-04-11

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  H01L21/683 ,  G02F1/1335 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L33/62 ,  H01L21/67 ,  H01L23/544 ,  H01L21/48 ,  H01L23/532

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75261 ,  H01L2224/75262 ,  H01L2224/75303 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/75651 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/75842 ,  H01L2224/75843 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066 ,  H01L2924/00014

摘要： A system to effectuate improved transfer of semiconductor die. A first frame secures a first substrate having the semiconductor die. A second frame secures a second substrate adjacent the first substrate. A needle is disposed adjacent to the first frame. The needle includes: a longitudinal surface extending in a direction toward the second frame, and a base end having a cross-sectional dimension being based, at least in part, on a cross-sectional dimension of the semiconductor die. A needle actuator is operably connected to the needle and is configured to actuate the needle such that, during the transfer operation, when the first substrate is secured in the first frame and the second substrate is secured in the second frame, the needle presses the semiconductor die into contact with the second substrate so as to transfer the semiconductor die onto the second substrate.

公开(公告)号：US10170454B2

公开(公告)日：2019-01-01

申请号：US15978093

申请日：2018-05-12

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L21/00 ,  H01L25/075 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L33/62 ,  H01L23/00 ,  H01L21/67 ,  H01L21/66 ,  H01L23/544 ,  H01L21/683 ,  H01L21/48

摘要： A system for performing a direct transfer of a plurality of semiconductor die from a first substrate to a second substrate based on map data of the location of the semiconductor die. A first conveyance mechanism conveys the first substrate. A second conveyance mechanism conveys the second substrate. A transfer mechanism is disposed adjacent to the first conveyance mechanism to effectuate the direct transfer. A controller causes one or more processors to perform operations including: determining positions of the plurality of semiconductor die based at least in part on map data, conveying at least one of the first substrate or the second substrate such that the first substrate, the second substrate, and the transfer mechanism are in a direct transfer position, and activating the transfer mechanism to perform the direct transfer of the plurality of semiconductor die.

公开(公告)号：US09748210B2

公开(公告)日：2017-08-29

申请号：US15074994

申请日：2016-03-18

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： B23P19/00 ,  H01L21/60 ,  H01L25/075 ,  H01L21/683 ,  H01L21/48 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L23/544 ,  H01L21/67 ,  H01L33/62

摘要： A method of transferring semiconductor devices to a product substrate includes positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and actuating a transfer mechanism to cause the transfer mechanism to engage a second surface of the semiconductor wafer. The second surface of the semiconductor wafer is opposite the first surface of the semiconductor wafer. Actuating the transfer mechanism includes causing a pin to thrust against a position on the second surface of the semiconductor wafer corresponding to a position of a particular semiconductor device located on the first surface of the semiconductor wafer, and retracting the pin to a rest position. The method further includes detaching the particular semiconductor device from the second surface of the semiconductor wafer, and attaching a particular semiconductor device to the product substrate.

公开(公告)号：US09633883B2

公开(公告)日：2017-04-25

申请号：US14939896

申请日：2015-11-12

申请人： Rohinni, LLC.

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H05K3/34 ,  H01L21/68 ,  H01L21/683 ,  H01L21/48 ,  H01L21/677 ,  H01L21/687 ,  H01L21/66 ,  H01L23/00 ,  H01L23/544

CPC分类号： H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/75261 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066

摘要： An apparatus includes a first frame to hold a wafer tape having a first side and a second side. A plurality of semiconductor device dies are disposed on the first side of the wafer tape. A second frame includes a first clamping member and a second clamping member to clamp therebetween a product substrate having a circuit trace thereon. The second frame is configured to hold the product substrate such that the circuit trace is disposed facing the dies on the wafer tape. A needle is disposed adjacent to the second side of the wafer tape. A length of the needle extends in a direction toward the wafer tape. A needle actuator is connected to the needle to move the needle to a die transfer position. A laser points toward a portion of the product substrate corresponding to the transfer position to affix the die.

公开(公告)号：US11069551B2

公开(公告)日：2021-07-20

申请号：US16200419

申请日：2018-11-26

申请人： Rohinni, LLC

发明人： Justin Wendt ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow ,  Andrew Huska

IPC分类号： H05K3/20 ,  H01L21/677 ,  H01L23/544 ,  H01L21/683 ,  H01L21/687

摘要： A method of dampening a force applied to an electrically-actuatable element during a transfer of the electrically-actuatable element from a first side of a first substrate to a second substrate. The method includes positioning a needle adjacent a second side of the first substrate opposite the first side of the first substrate. The needle is moved via a needle actuator to a position at which the needle presses on the second side of the first substrate to press the electrically-actuatable element into contact with the second substrate disposed adjacent the first side of the first substrate. A force applied to the electrically-actuatable element is dampened when the needle presses the electrically-actuatable element into contact with the second substrate.

公开(公告)号：US20200243491A1

公开(公告)日：2020-07-30

申请号：US16792045

申请日：2020-02-14

申请人： Rohinni, LLC

发明人： Cody Peterson ,  Clinton Adams ,  Sean Kupcow ,  Andrew Huska

IPC分类号： H01L25/075 ,  H01L23/532 ,  H01L21/677 ,  H01L21/67 ,  H01L21/66 ,  G02F1/13357 ,  H01L33/62 ,  H01L23/00 ,  H01L21/687 ,  H01L21/68 ,  H01L21/48 ,  H01L23/544 ,  H01L21/683

摘要： A semiconductor device die transfer apparatus includes a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape and a second frame to secure a product substrate having a circuit trace thereon. The second frame is configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape. Additionally, a rotary transfer collet is disposed between the wafer tape and the product substrate. The rotary transfer collet has a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.

公开(公告)号：US20200235081A1

公开(公告)日：2020-07-23

申请号：US16841090

申请日：2020-04-06

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L25/075 ,  H01L23/532 ,  H01L21/677 ,  H01L21/67 ,  H01L21/66 ,  G02F1/13357 ,  H01L33/62 ,  H01L23/00 ,  H01L21/687 ,  H01L21/68 ,  H01L21/48 ,  H01L23/544 ,  H01L21/683

摘要： A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.

公开(公告)号：US10325885B2

公开(公告)日：2019-06-18

申请号：US15691657

申请日：2017-08-30

申请人： Rohinni, LLC

发明人： Andrew Huska ,  Cody Peterson ,  Clinton Adams ,  Sean Kupcow

IPC分类号： H01L21/687 ,  H01L21/66 ,  H01L23/544 ,  H01L23/00 ,  H01L25/075 ,  H01L21/683 ,  H01L21/48 ,  H01L21/677 ,  H01L21/68 ,  H01L21/67 ,  H01L33/62 ,  G02F1/1335 ,  H01L23/532

摘要： An elongated light circuit includes an elongated circuit trace and a plurality of micro-sized, unpackaged LEDs disposed sequentially on the circuit trace. A height of the LEDs ranges from about 12.5 microns to about 200 microns. The elongated circuit trace and the LEDs are coated with a protective coating.