Invention Application
- Patent Title: PACKAGE MEMS SWITCH AND METHOD
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Application No.: US15633237Application Date: 2017-06-26
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Publication No.: US20180138001A1Publication Date: 2018-05-17
- Inventor: Qing Ma , Johanna M. Swan , Valluri Rao , Feras Eid
- Applicant: Intel Corporation
- Main IPC: H01H59/00
- IPC: H01H59/00 ; H01H50/00 ; H01Q5/314
Abstract:
An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.
Public/Granted literature
- US10453635B2 Package MEMS switch and method Public/Granted day:2019-10-22
Information query
