- 专利标题： COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
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申请号： US15895172申请日： 2018-02-13
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公开(公告)号： US20180175075A1公开(公告)日： 2018-06-21
- 发明人: Shuwei Sun , Francois-Charles Dary , Marc Abouaf , Patrick Hogan , Qi Zhang
- 申请人： Shuwei Sun , Francois-Charles Dary , Marc Abouaf , Patrick Hogan , Qi Zhang
- 主分类号： H01L27/12
- IPC分类号： H01L27/12 ; H01L29/66 ; C21D9/00 ; C22F1/08 ; C21D1/00 ; C22F1/00 ; C22F1/14 ; C22F1/04 ; B81C1/00 ; H01B1/02 ; G06F3/044 ; G06F3/041 ; H01L29/49 ; H01L29/786 ; H01L23/532
摘要：
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
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