A thermal interface material, a method for preparing a thermal interface material, a thermally conductive pad, and a heat dissipation system are provided. In one example, the thermal interface material includes a metal zirconium coil and carbon nanotube arrays, where the metal zirconium coil has a first surface and a second surface that is opposite to the first surface. The carbon nanotubes in the carbon nanotube arrays are distributed on the first surface and the second surface. Further, the first surface and the second surface of the metal zirconium coil include exposed metal zirconium. Therefore, interface thermal resistance of the thermal interface material is reduced, and a heat conducting property of the thermal interface material is improved.