A clip for use with an electronic package, includes a frame structure with a pair of first side bars and a pair of second side bars commonly defining a receiving cavity. An ejection device is formed on one first side bar, including a stopper/kicker and a presser interlinked with each other in a co-movement manner. A latch is located around the ejection device so as to cooperate with the stopper/kicker to secure the electronic package therebetween in a vertical direction and retain the electronic package in the receiving cavity to result in an electrical assembly.