Invention Application
- Patent Title: RESIN FILM
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Application No.: US15741612Application Date: 2016-06-01
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Publication No.: US20180193804A1Publication Date: 2018-07-12
- Inventor: Hajime YAMAMOTO , Tsukasa MIYAZAKI , Yuuki TAKEDA , Satoru FURUYAMA
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Priority: JP2015-138172 20150709
- International Application: PCT/JP2016/002630 WO 20160601
- Main IPC: B01D69/06
- IPC: B01D69/06 ; B01D71/48 ; B01D71/64 ; B23K15/08 ; B29C67/20 ; C08J9/00

Abstract:
A resin film has through holes formed to extend through the thickness of the resin film. The through holes are pillar-shaped. An average density of the through holes is 1×106 to 1×1012 holes/cm2. An average diameter of the through holes is 1 to 310 nm. A degree of variability of the diameter of the through holes is 30% or less, the degree of variability of the diameter of the through holes obtained by dividing a standard deviation of the diameter of the through holes by the average diameter of the through holes and multiplying the resulting value by 100.
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