公开(公告)号：US20180193804A1

公开(公告)日：2018-07-12

申请号：US15741612

申请日：2016-06-01

Applicant: NITTO DENKO CORPORATION

Inventor： Hajime YAMAMOTO ,  Tsukasa MIYAZAKI ,  Yuuki TAKEDA ,  Satoru FURUYAMA

IPC: B01D69/06 ,  B01D71/48 ,  B01D71/64 ,  B23K15/08 ,  B29C67/20 ,  C08J9/00

CPC classification number: B01D69/06 ,  B01D69/00 ,  B01D71/48 ,  B01D71/64 ,  B23K15/00 ,  B23K15/08 ,  B29C67/20 ,  C08J9/00

Abstract: A resin film has through holes formed to extend through the thickness of the resin film. The through holes are pillar-shaped. An average density of the through holes is 1×106 to 1×1012 holes/cm2. An average diameter of the through holes is 1 to 310 nm. A degree of variability of the diameter of the through holes is 30% or less, the degree of variability of the diameter of the through holes obtained by dividing a standard deviation of the diameter of the through holes by the average diameter of the through holes and multiplying the resulting value by 100.