A light emitting diode (LED) lamp assembly includes a base including an electrical connector adapted to electrically engage a socket. A thermally conductive enclosure is coupled to the base, and a printed circuit board is disposed within the thermally conductive enclosure. The printed circuit board is operably electrically connected with the base and the electrical connector and thermally coupled to the enclosure. An LED is disposed on an exterior surface of the housing and electrically coupled to the printed circuit board. The thermally conductive enclosure is adapted to mechanically and thermally engage the socket to sink heat generated by the printed circuit board and the light source from the lamp assembly into the socket and an associated reflector.