- 专利标题: PRIMER COMPOSITIONS FOR INJECTION MOLDING
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申请号: US15938547申请日: 2018-03-28
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公开(公告)号: US20180215929A1公开(公告)日: 2018-08-02
- 发明人: Brian Deegan , Darren Nolan , Brendan Kneafsey , Mark Loane
- 申请人: Henkel IP & Holding GmbH
- 优先权: GB1517106.9 20150928
- 主分类号: C09D5/00
- IPC分类号: C09D5/00 ; C09D4/06 ; B29C45/14
摘要:
A curable primer composition comprising: (a) a curable component such as methacrylate; (b) a cure initiating component; and (c) a polymer material selected from the group consisting of: (i) block polymers represented by S-A-S where S is polystyrene and A stands for a polymer or copolymer formed from one or more of ethylene, propylene, butylene, and styrene, which are optionally substituted with carboxylic acid or maleic anhydride; provided that when A comprises styrene then A is a copolymer of styrene with at least one of ethylene, propylene and butylene, and is optionally substituted with carboxylic acid or maleic anhydride; and (ii) polystyrene-poly(ethylene-propylene) (“SEP”); and (iii) any combination of said polymer materials. The composition is applied to a part then photocured. It is dry to touch. Thereafter a thermoplastic material such as a polyolefin is overmolded (e.g. injection molded) over the applied composition. It enhances bond strength of the polyolefin to the part.
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