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    PRIMER COMPOSITIONS FOR INJECTION MOLDING
    4.
    发明申请
    PRIMER COMPOSITIONS FOR INJECTION MOLDING 审中-公开

    公开(公告)号：US20200339823A1

    公开(公告)日：2020-10-29

    申请号：US16922065

    申请日：2020-07-07

    申请人： Henkel IP & Holding GmbH

    发明人： Brian Deegan ,  Darren Nolan ,  Brendan Kneafsey ,  Mark Loane

    IPC分类号： C09D5/00 ,  C09D4/06 ,  C09D153/02 ,  C08F285/00 ,  C08F287/00 ,  B29C45/14

    摘要： A curable primer composition comprising:(a) a curable component such as methacrylate; (b) a cure initiating component; and (c) a polymer material selected from the group consisting of: (i) block polymers represented by S-A-S where S is polystyrene and A stands for a polymer or copolymer formed from one or more of ethylene, propylene, butylene, and styrene, which are optionally substituted with carboxylic acid or maleic anhydride; provided that when A comprises styrene then A is a copolymer of styrene with at least one of ethylene, propylene and butylene, and is optionally substituted with carboxylic acid or maleic anhydride; and (ii) polystyrene-poly(ethylene-propylene) (“SEP”); and (iii) any combination of said polymer materials. The composition is applied to a part then photocured. It is dry to touch. Thereafter a thermoplastic material such as a polyolefin is overmolded (e.g. injection molded) over the applied composition. It enhances bond strength of the polyolefin to the part.

    ACTIVATING SURFACES FOR SUBSEQUENT BONDING
    5.
    发明申请
    ACTIVATING SURFACES FOR SUBSEQUENT BONDING 有权

    公开(公告)号：US20210292603A1

    公开(公告)日：2021-09-23

    申请号：US17340259

    申请日：2021-06-07

    申请人： Henkel IP & Holding GmbH

    发明人： Brian Deegan ,  Gavin Haberlin ,  Brendan Kneafsey ,  Stephen Fearon

    IPC分类号： C09J5/02 ,  C08J5/12 ,  C08J7/12 ,  C09J7/50 ,  C09J7/35 ,  C09J7/38 ,  C09J7/25 ,  B29C65/48 ,  B29C65/82 ,  B29C65/00

    摘要： A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

    ACTIVATING SURFACES FOR SUBSEQUENT BONDING
    6.
    发明申请
    ACTIVATING SURFACES FOR SUBSEQUENT BONDING 有权

    公开(公告)号：US20210253806A1

    公开(公告)日：2021-08-19

    申请号：US17184760

    申请日：2021-02-25

    申请人： Henkel IP & Holding GmbH

    发明人： Brian Deegan

    IPC分类号： C08J3/28 ,  C09J5/02 ,  C09J163/00 ,  C08J5/12 ,  C09J133/08 ,  B29C65/00

    摘要： A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

    Cure of anaerobic compositions
    7.
    发明授权
    Cure of anaerobic compositions 有权

    公开(公告)号：US10414948B2

    公开(公告)日：2019-09-17

    申请号：US16036303

    申请日：2018-07-16

    申请人： HENKEL IP & HOLDING GMBH

    发明人： James Houlihan ,  Nigel Sweeney ,  Brian Deegan ,  Brendan Kneafsey

    IPC分类号： C09J5/04 ,  C09J133/12

    摘要： A bonding system for bonding a plastic substrate to another substrate, the bonding system comprising a plastic substrate wherein the plastic substrate is impregnated with a transition metal; and an anaerobically curable composition. Cure of the anaerobically curable composition is initiatable by the transition metal when the anaerobically curable composition is contacted with the plastic substrate under anaerobic conditions.