发明申请
- 专利标题: LATEX COMPOSITION FOR DIP-FORMING AND DIP-FORMED ARTICLE PRODUCED THEREFROM
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申请号: US15751006申请日: 2016-10-05
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公开(公告)号: US20180230244A1公开(公告)日: 2018-08-16
- 发明人: Seung Hun Yang , Seung Uk Yeu , Jung Su Han , Jung Eun Kim
- 申请人: LG Chem, Ltd.
- 申请人地址: KR Seoul
- 专利权人: LG Chem, Ltd.
- 当前专利权人: LG Chem, Ltd.
- 当前专利权人地址: KR Seoul
- 优先权: KR10-2015-0164395 20151124
- 国际申请: PCT/KR2016/011127 WO 20161005
- 主分类号: C08C19/34
- IPC分类号: C08C19/34 ; B29C41/14 ; B29C41/00
摘要:
Disclosed is a latex composition for dip-molding and a dip-molded article produced therefrom. More specifically, a dip-molded article having slow syneresis, less stickiness and superior tensile strength is produce by dip-molding of a carbonic acid-modified nitrile-based copolymer latex having increased molecular stability due to the combined use of alkenylsuccinate, which is an emulsifier crosslinkable with the latex and having a flexible molecular structure.
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