发明申请
- 专利标题: SOLID-STATE IMAGING APPARATUS, METHOD FOR MANUFACTURING THE SAME, AND IMAGING SYSTEM
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申请号: US15908997申请日: 2018-03-01
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公开(公告)号: US20180261637A1公开(公告)日: 2018-09-13
- 发明人: Takashi Moriyama , Masaaki Minowa , Takeshi Ichikawa , Masahiro Ogawa
- 申请人: CANON KABUSHIKI KAISHA
- 优先权: JP2013-210588 20131007
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H04N5/374 ; H04N5/33 ; H04N5/265 ; H04N5/232
摘要:
A solid-state imaging apparatus, comprising a first semiconductor region of a first conductivity type provided on a substrate by an epitaxial growth method, a second semiconductor region of the first conductivity type provided on the first semiconductor region, and a third semiconductor region of a second conductivity type provided in the second semiconductor region so as to form a pn junction with the second semiconductor region, wherein the first semiconductor region is formed such that an impurity concentration decreases from a side of the substrate to a side of the third semiconductor region, and an impurity concentration distribution in the second semiconductor region is formed by an ion implantation method.
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