Invention Application
- Patent Title: Anodized Layer and Aluminum Layer over Substrate
-
Application No.: US15519697Application Date: 2015-04-30
-
Publication No.: US20180298499A1Publication Date: 2018-10-18
- Inventor: CHI HAO CHANG , CHALAM KASHYAP , KUAN-TING WU
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- International Application: PCT/US2015/028643 WO 20150430
- Main IPC: C23C28/02
- IPC: C23C28/02 ; B32B15/01 ; C23C24/10 ; C25D11/04 ; C23F17/00

Abstract:
Various examples described herein provide for a substrate, or a method for preparing a substrate, including an aluminum layer and an anodized layer over a substrate. For instance, the substrate may comprise a substrate, a continuous aluminum layer formed over the substrate, and an anodized layer formed over the continuous aluminum layer.
Information query
IPC分类: