Techniques and mechanisms for providing connectivity to integrated circuitry using a lead frame. In an embodiment, the lead frame includes a conductor which forms a frame portion and a plurality of branch structures each extending from the frame portion. The frame portion is disposed in a region between a first plane and a second plane, wherein a portion of a first branch structure extends outside of the region. In another embodiment, the plurality of branch structures are coupled to integrated circuitry, and the frame portion is subsequently removed to form from the plurality of branch structures a plurality of leads. Removal of the frame portion forms a first lead from the first branch structure, wherein the first lead extends over or under one or more other structures in the region between the first plane and the second plane.