公开(公告)号：US20190190236A1

公开(公告)日：2019-06-20

申请号：US16325154

申请日：2016-09-29

Applicant: Sundaram ARVIND ,  Intel Corporation

Inventor： Arvind SUNDARAM

IPC: H01S5/40 ,  H04B10/114 ,  H04B10/80 ,  H01S5/00

CPC classification number: H04B10/803 ,  H01S5/005 ,  H01S5/4087 ,  H04B10/1143 ,  H04B10/801

Abstract: An apparatus comprises a substrate; a laser emitter arranged on the substrate; a photodiode arranged on the substrate; resin encapsulating the laser emitter and the photodiode, wherein the resin includes a top surface above the laser emitter and photodiode; and a lens arranged on the top surface of the resin.

公开(公告)号：US20180301272A1

公开(公告)日：2018-10-18

申请号：US15486178

申请日：2017-04-12

Applicant: Intel Corporation

Inventor： Arvind SUNDARAM

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/24 ,  H01F41/04 ,  H01F41/10 ,  G02F1/09

Abstract: Techniques and mechanisms for providing a flexible inductor. In an embodiment, the flexible inductor comprises a metal foil or other planar conductor, and inductive bodies disposed on opposite respective sides of the planar conductor. The inductive bodies each comprise a respective flexible suspension media and ferromagnetic particles disposed therein. A thickness of the planar conductor is in a range of 0.1 millimeters (mm) to 0.3 mm. In another embodiment, different layers of one inductive body vary from one another with respect to a thickness, a ferromagnetic material, a suspension media, an average size of ferromagnetic particles or a volume fraction of ferromagnetic particles.

公开(公告)号：US20180301269A1

公开(公告)日：2018-10-18

申请号：US15486167

申请日：2017-04-12

Applicant: Intel Corporation

Inventor： Arvind SUNDARAM

IPC: H01F27/22 ,  H01F27/28 ,  H01F27/29 ,  H01F27/24 ,  H01L23/64 ,  H01L23/367 ,  H01L23/373

Abstract: Techniques and mechanisms for providing an inductor with integrated heat dissipation structures. In an embodiment, the inductor includes an electrical conductor and a ferromagnetic body, wherein a portion of the conductor extends through the ferromagnetic body. The conductor further includes other portions which extend from the ferromagnetic body, wherein the other portions each further form or couple to respective fin structures. In another embodiment, the inductor includes multiple distinct ferromagnetic bodies, where different portions of the conductor variously extend each through a respective one of the ferromagnetic bodies.

公开(公告)号：US20190008030A1

公开(公告)日：2019-01-03

申请号：US16122786

申请日：2018-09-05

Applicant: Intel Corporation

Inventor： Arvind SUNDARAM

IPC: H05K1/02 ,  G06F1/20 ,  H05K1/18 ,  H05K7/20

Abstract: Techniques and mechanisms for providing efficient heat dissipation by a circuit assembly. In an embodiment, the circuit assembly includes an inductor and a packaged device coupled thereto, where the inductor forms heat dissipation structures on various respective sides of a ferromagnetic body. The packaged assembly comprises a circuit board disposed in a mold material, where a metal core of the circuit board is thermally coupled to transfer heat from one or more circuit components of the packaged device to the inductor via one or more conductors extending from the package mold. In another embodiment, portions of the metal core have different respective vertical spans which contribute to different thermal conductivity characteristics across various regions of the circuit board.

公开(公告)号：US20190113949A1

公开(公告)日：2019-04-18

申请号：US16217303

申请日：2018-12-12

Applicant: Intel Corporation

Inventor： Arvind SUNDARAM

IPC: G06F1/16 ,  H05K1/05

Abstract: Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

公开(公告)号：US20180301401A1

公开(公告)日：2018-10-18

申请号：US15486171

申请日：2017-04-12

Applicant: Intel Corporation

Inventor： Arvind SUNDARAM

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31

Abstract: Techniques and mechanisms for providing connectivity to integrated circuitry using a lead frame. In an embodiment, the lead frame includes a conductor which forms a frame portion and a plurality of branch structures each extending from the frame portion. The frame portion is disposed in a region between a first plane and a second plane, wherein a portion of a first branch structure extends outside of the region. In another embodiment, the plurality of branch structures are coupled to integrated circuitry, and the frame portion is subsequently removed to form from the plurality of branch structures a plurality of leads. Removal of the frame portion forms a first lead from the first branch structure, wherein the first lead extends over or under one or more other structures in the region between the first plane and the second plane.

公开(公告)号：US20180301271A1

公开(公告)日：2018-10-18

申请号：US15486176

申请日：2017-04-12

Applicant: Intel Corporation

Inventor： Arvind SUNDARAM

IPC: H01F27/28 ,  H01F27/24 ,  H01F41/098 ,  H01F41/02 ,  H05K5/00 ,  G06F1/16

CPC classification number: H01F27/28 ,  G06F1/1616 ,  H01F27/24 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/2847 ,  H01F41/0206 ,  H01F41/098 ,  H05K5/0017

Abstract: Techniques and mechanisms for delivering power with a transformer. In an embodiment, the transformer comprises a dielectric slab structure, a first conductor, a layer of ferromagnetic material disposed around first windings of the first conductor, and a second conductor which forms second windings around the layer of ferromagnetic material. For one of the first windings or one of the second windings, a cross-section of the winding conforms to a rectangle, wherein a width of the cross-section which is more than a height of the cross-section. A ferromagnetic material of the ferrite layer extends between successive ones of the first windings. In another embodiment, a volume fraction of the ferromagnetic material in the ferrite layer is equal to or less than ninety seven percent (97%).

公开(公告)号：US20240312690A1

公开(公告)日：2024-09-19

申请号：US18120761

申请日：2023-03-13

Applicant: Intel Corporation

Inventor： Ashish SHARMA ,  Arvind SUNDARAM ,  Vikas MISHRA ,  Vimal John CYRIL

IPC: H01F27/28 ,  H01F27/26 ,  H05K1/16 ,  H05K3/00

CPC classification number: H01F27/2804 ,  H01F27/266 ,  H05K1/165 ,  H05K3/005 ,  H01F2027/2809

Abstract: Embodiments disclosed herein include a motherboard. In an embodiment, the motherboard comprises a first layer with a first trace with a shape. In an embodiment, an insulating layer is provided over the first layer. In an embodiment, a second layer with a second trace with the shape is over the insulating layer. In an embodiment, the second trace is provided directly over the first trace.

公开(公告)号：US20190199445A1

公开(公告)日：2019-06-27

申请号：US16329691

申请日：2016-09-29

Applicant: Arvind S. ,  Intel Corporation

Inventor： Arvind SUNDARAM

IPC: H04B10/80 ,  H04B10/50 ,  H04B10/69

CPC classification number: H04B10/803 ,  H04B10/503 ,  H04B10/6911

Abstract: An apparatus comprises a laser emitter configured to transmit laser energy across an air gap to a separate device; a photodiode configured to detect laser energy received across the air gap from the separate device; and logic circuitry configured to initiate recurrent transmission of a laser pulse by the laser emitter; and end the recurrent transmission in response to detecting laser energy received by the photodiode from the separate device.

公开(公告)号：US20180302984A1

公开(公告)日：2018-10-18

申请号：US15486174

申请日：2017-04-12

Applicant: Intel Corporation

Inventor： Arvind SUNDARAM

IPC: H05K1/05 ,  H05K3/44 ,  H05K3/30 ,  H05K1/18 ,  G06F1/16

CPC classification number: G06F1/1626 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/09054 ,  H05K2203/0323

Abstract: Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.