An imprint apparatus performs an imprint process of forming a pattern on a substrate by bringing a mold into contact with an imprint material on the substrate and curing the imprint material. The apparatus includes a detector configured to detect an arrangement relationship between the substrate and the mold, and an adjuster configured to adjust the arrangement relationship based on an output from the detector. The adjuster adjusts the arrangement relationship in a state in which a vibration is applied to an imprint material between the substrate and the mold, and then further adjusts the arrangement relationship in a state in which the vibration is not applied to the imprint material between the substrate and the mold.