Invention Application
- Patent Title: SAW WIRE AND CUTTING APPARATUS
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Application No.: US15974918Application Date: 2018-05-09
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Publication No.: US20180326517A1Publication Date: 2018-11-15
- Inventor: Tomohiro KANAZAWA , Tetsuji SHIBATA , Kazushige SUGITA , Hiroshi GOUDA , Naoki KOHYAMA
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LT D.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LT D.
- Current Assignee Address: JP Osaka
- Priority: JP2017-094233 20170510
- Main IPC: B23D61/18
- IPC: B23D61/18 ; B23D65/00 ; C25D3/12 ; C25D7/06 ; C25D15/00 ; C25D5/50

Abstract:
A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A nickel plating layer is provided over the metal wire. An adhesion layer is provided at an interface between the metal wire and the nickel plating layer. The adhesion layer contains nickel and tungsten. A plurality of abrasive particles are provided at a surface of the nickel plating layer.
Public/Granted literature
- US10722962B2 Saw wire and cutting apparatus Public/Granted day:2020-07-28
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